Model Number | Electronic Design |
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Type | Custom |
Base Material | FR4 |
Copper Thickness | Up To 6 Oz |
Board Thickness | 1.6-6 Mm |
Type | Rigid Circuit Board |
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Processing Technology | Electrolytic Foil |
Base Material | FR-4 |
Surface Finishing | HASL Lead Free |
Copper Thickness | 1oz |
Type | Rigid Circuit Board |
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Origin | Guangdong, China |
Base Material | Fr-4 |
Insulation Materials | Organic Resin |
Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
Place Of Origin | Guangdong, China |
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Application | Electronics Device |
Custom | OEM/ODM |
Base Material | Copper |
Insulation Materials | Organic Resin |
Type | PCB Assembly, 94V0 Electronic |
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Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Material | FR4 CEM1 CEM3 Hight TG |
Base Material | FR4 |
Type | Customizable |
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Usage | OEM Electronics |
Base Material | FR4 |
Min. Line Spacing | 3 Mil (0.075 Mm) |
Board Thickness | 1.6mm |
Model NO. | Rigid-Flex Board |
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Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
Insulation Materials | Epoxy Resin |
PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
Service | PCB, PCBA, SMT, Components |
Type | Rigid Circuit Board |
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Origin | Guangdong, China |
Base Material | Copper |
Material | Complex |
Insulation Materials | Organic Resin |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Surface Finishing | Lead Free HASL/ENIG/OSP |
Board Thickness | 1.6mm |