Name | FPC |
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Base Material | FR-4 |
Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
Surface Finishing | Immersion Gold |
Copper Thickness | 1oz |
Type | FPC, Dual Sides |
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Min. Line Spacing | 0.1mm/4mil |
Min. Hole Size | 0.1mm-0.2mm |
Surface Finishing | HASL,Immersion Gold,ENIG |
Base Material | PI |
Brand Name | OEM ODM |
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Base Material | FR-4/aluminum/ceramic/cem-3/FR-1, FR-4/aluminum/ce |
Copper Thickness | 0.25 Oz -12 Oz |
Board Thickness | 0.005"-0.250" |
Min. Hole Size | 0.20mm |
Model Number | Customized |
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Place Of Origin | Guangdong, China |
Base Material | PI |
Min. Line Spacing | 0.1mm |
Copper Thickness | 1-6 Oz |
Shipping Method | By Air, By Sea, By Land |
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Metal Coating | Copper |
Mode Of Production | SMT |
PCB/PCBA Max Size | 400*310mm |
Production Lines | SMT &DIP Production Lines , Assembly Lines |
Model Number | Multilayer Pcba |
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Type | Consumer Electronics Pcba |
Brand Name | OEM |
Supplier Type | Multilayer Pcba Manufacture |
Copper Thickness | 1 Oz |
Supplier Type | Customized |
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Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Base Material | FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 0.5~3.2mm |
Place Of Origin | Guangdong, China |
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Base Material | Fr4, Any Specialized Material As Per Your Choice |
Copper Thickness | 0.3- 6 OZ |
Board Thickness | 0.3mm-3.2mm |
Min. Hole Size | 0.20mm |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Epoxy Resin |
Flame Retardant Properties | V0 |
Processing Technology | Electrolytic Foil |
Model Number | Electronic Design |
---|---|
Type | Custom |
Base Material | FR4 |
Copper Thickness | Up To 6 Oz |
Board Thickness | 1.6-6 Mm |