| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Layer | 1-40 Layer |
| Solder Mask | Green/Blue/Red |
| Type | Print Circuit Board Board Components |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 4 Oz, Inner:12-175um Outer:35-350um |
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Board Thickness | 2L: 0.20mm, 4L: 0.40mm, 6L:0.60mm, 8L:0.80mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Model Number | PCBA-0606 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Brand Name | OEM/RZY |
|---|---|
| Model Number | RZY-Q108 |
| Material Types | Fr-4, Fr-5, High-Tg, Aluminum Based Halo |
| Copper Thickness | 1 Oz |
| Board Thickness | 0.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | PCBA-1017 |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Product Name | Pcb Board Component |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mil |
