| Type | Wireless Charging Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | PCB,PCBA,FPC,HDI,RFPC |
| Copper Thickness | 1 Oz |
| Base Material | FR-4 |
| Brand Name | OEM/RZY |
|---|---|
| Model Number | RZY-Q108 |
| Material Types | Fr-4, Fr-5, High-Tg, Aluminum Based Halo |
| Copper Thickness | 1 Oz |
| Board Thickness | 0.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | PCBA-1017 |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Product Name | Pcb Board Component |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
