| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Wireless Charging Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | PCB,PCBA,FPC,HDI,RFPC |
| Copper Thickness | 1 Oz |
| Base Material | FR-4 |
| Model Number | OEM/ODM/EMS |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Layer | 1-40 Layer |
| Model NO | Double Sided PCB-4 |
|---|---|
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Model | FR-4 |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Model Number | UC008 |
|---|---|
| Type | Consumer Electronics Pcba |
| Place Of Origin | Guangdong |
| Copper Thickness | 1 Oz, 1/1 OZ |
| Base Material | FR-4 |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Layer | 1-40 Layer |
| Solder Mask | Green/Blue/Red |
| Supplier Type | Customized |
|---|---|
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Aluminum |
| Insulation Materials | Epoxy Resin |
| Layer | 1-40 Layer |
| Board Thickness | 0.2-8.0mm |
| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
