| Type | FPC, Dual Sides |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-0.2mm |
| Surface Finishing | HASL,Immersion Gold,ENIG |
| Base Material | PI |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Min. Line Spacing | 0.1mm |
| Copper Thickness | 1-6 Oz |
| Brand Name | POE |
|---|---|
| Base Material | FR4 |
| Copper Thickness | 1oz |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.2mm |
| Model NO | Double Sided PCB-4 |
|---|---|
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Model | FR-4 |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Board Thickness | 0.4-3.2mm |
| Solder Mask | Green/Blue/Red |
| Type | Consumer Electronics PCBA, USB Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Keywords | OEM Contract Manufacturing PCB |
| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| PCB/PCBA Max Size | 400*310mm |
| Production Lines | SMT &DIP Production Lines , Assembly Lines |
| Layers | Double-Layer |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Aluminum |
| Insulation Materials | Epoxy Resin |
| Layer | 1-40 Layer |
| Board Thickness | 0.2-8.0mm |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
