| Color Of PCB | Green、Black 、Orange、Blue、Customized |
|---|---|
| Connector | Type C、USB、Micro USB |
| Base Material | Fr4/Customized |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM |
| Product Name | FPC |
| Quality Assurance | AOI IQC PQC QA |
| Layer Count | 2-12 |
|---|---|
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Dam | 3mil |
| Copper Thickness | 2-6oz |
| Min. Solder Mask Bridge | 3mil |
| Base Material | FR4 (Tg130~Tg170) |
|---|---|
| Insulation Materials | Organic Resin |
| Board Material | Fr4 And Polyimide |
| Layers | 1-40 Layers |
| Board Thickness | 1.6mm |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Materia | FR-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Material | Fiberglass Epoxy |
| Board Material | Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base |
